Director of Packaging Team – Research and Development Location – Cambridge, UK Contract – Permanent About CGD Making Sustainable Power Electronics Possible A spin-out of the Cambridge University, Cambridge GaN Devices (CGD) is a fabless semiconductor
Overview At Microsoft Research, we are shaping the next generation of AI infrastructure through long-horizon programmes spanning devices, systems, software and hardware. As a Principal Optical Packaging Engineer, you will own the package architecture and assembly
Overview A Senior Process Engineer is required to join an industry leading client based in Cambridge, Cambridgeshire. This is an exciting time to join this company as they continue their journey producing leading edge next generation
Job ID: Posted: Location: United Kingdom, Cambridgeshire, CambridgeEmployment type: Full-TimeWork site: 3 days / week in-officeRole type: Individual ContributorTravel: Less than 25%Profession: Research, Applied, & Data SciencesDiscipline: Research SciencesCompany: MicrosoftOverviewAt Microsoft Research, we are shaping the
Company OverviewKLA is a global leader in diversified electronics for the semiconductor manufacturing ecosystem. Virtually every electronic device in the world is produced using our technologies. No laptop, smartphone, wearable device, voice-controlled gadget, flexible screen, VR
The Head of Foundry owns fabrication reality. This role exists to ensure that what we design can actually be fabricated at yield, at scale, and without surprises. The role As Head of Foundry, you are accountable
Are you an experienced Development Engineer with a background in semiconductor, photonics or advanced manufacturing? Do you enjoy taking new products from concept through to production while working on cutting-edge technologies? Rising Talent Recruitment is working
Manufacturing Engineer – Semiconductor Assembly (Microelectronics & Optoelectronics) – Night shift Company Background ALTER TECHNOLOGY TÜV NORD UK Limited (ALTER UK) provides contract package design and assembly services for a wide range of semiconductor devices. ALTER
Overview At Microsoft Research, we are shaping the next generation of AI infrastructure through long-horizon programmes spanning devices, systems, software and hardware. As a Principal Optical Packaging Engineer, you will own the package architecture and assembly